Advances in Electronic Circuit Packaging: Volume 5 by George R. Dallimore (auth.), Lawrence L. Rosine (eds.)

By George R. Dallimore (auth.), Lawrence L. Rosine (eds.)

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Additional info for Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–2

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I0. Then the Ioading rail is attached to the R. E. Klein and J. Garnmon 52 Fig. 9. Type of printed circuit board used in heat-sink module. ~ Fig. 10. Force diagram of electrical and mechanical loading. The Heat-Sink Module 53 module mounting rail by means of screws. This accomplishes the heat transfer connection indicated as force F2; it also provides a very solid and rigid method of mounting. The top half of Fig. 12 illustrates the front and rear of such an assembly; the bottom figure shows the same assembly with the two loading rails detached and two modules removed.

Garnmon 56 Derived Features The heat-sink module has heat management as its primary design consideration; however, many useful features are inherent in a low-thermal-resistance system. Shielding, self-contained within the module, is just one of these features. Such shielding could be augmented by inserting small meta! plates between the modules. This provides isolation between modules in addition to the self-contained shielding between the two sides of the module. By using the heat sink as a common ground point, a good, repeatable ground path can be achieved, thus making it a likely candidate for high-speed logic or high-gain analog circuits.

Arger heat sink, and the other end has a holt-type provision for mounting. ltem C of Fig. 13 shows sleeve-type mounting provisions on both ends of the heat sink for the purpose of direct chassis mounting. ltems A, C, and D of Fig. 14 show heat sinks with both ends enlarged for the purpose of The Heat-Sink Module 55 a b c Fig. 13. Heat-sink modules. increasing the mass of the heat sink at the point of thermal interconnection. This added mass minimizes the possibility of darnage to components in the module from external transient thermal pulses.

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